Material | Issue | Process |
DAF/DAP | Voids | DB, Die Attach |
Lamination | ||
Encapsulation | ||
TIM | Voids | Metal Soldering |
Paste Sintering | ||
NCF | Cold Joint Voids |
HBM stacking |
Under-fill | Voids | CUF |
EMC | Warpage | EMIB, CoWoS, InFO |
Polyimide | Voids UPH Adhesion |
RDL |