Process Solution Provider
Over 1,800 Solutions of process de-voiding shipped, proven applying in various process,
packages and materials in Semiconductor assembly field.
packages and materials in Semiconductor assembly field.
Process
Process – the impact from APT solution platform
Enable to redefine the specification of Process Machine & Material
APT’s solution not just benefit product quality but also cost through redefining the specification of process machine & material which impacts supplier and offers various selections to user.
Package
Severe process issues in Advanced Packaging
Process Issues
Materials in Advanced Packages
Advanced Package
| Material | Issue | Process |
| DAF/DAP | Voids | DB, Die Attach |
| Lamination | ||
| Encapsulation | ||
| TIM | Voids | Metal Soldering |
| Paste Sintering | ||
| NCF | Cold Joint Voids |
HBM stacking |
| Under-fill | Voids | CUF |
| EMC | Warpage | EMIB, CoWoS, InFO |
| Polyimide | Voids UPH Adhesion |
RDL |
APT Solutions
Fanout Package / Process
The best leading-edge solution of Fanout Wafer Level Packaging
offers Devoid & Cure solution
offers Devoid & Cure solution
Material
The best wide-range coverage of de-void solutions for adhesive materials in assembly process
Customized Program
