制程解决方案与产品应用

Process Solution Provider

制程解决方案
全球超过1200套制程除泡解决方案,应用于各类制程、封装与材料
制程


印能解决方案平台对制程带来的正向影响


Enable to redefine the specification of Process Machine & Material

APT’s solution not just benefit product quality but also cost through redefining the specification of process machine & material which impacts supplier and offers various selections to user.
封装

先进封装必定遇到的课题


Process Issues

Materials in Advanced Packages

Advanced Package


Material Issue Process
DAF/DAP Voids DB, Die Attach
Lamination
Encapsulation
TIM Voids Metal Soldering
Paste Sintering
NCF Cold Joint
Voids
HBM stacking
Under-fill Voids CUF
EMC Warpage EMIB,
CoWoS, InFO
Polyimide Voids
UPH
Adhesion
RDL

APT Solutions

扇出晶圆级封装与制程

扇出晶圆级封装制程除泡烘烤的最佳解决方案


offers Devoid & Cure solution

offers Devoid & Cure solution

材料

封装制程黏合材料,提供最佳制程除泡方案复盖


量身订做计画

想进一步了解制程解决方案或提出问题吗?

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