製程解決方案與產品應用

Process Solution Provider

全球超過1200套製程除泡解決方案,應用於各類製程、封裝與材料
製程


印能解決方案平台對製程帶來的正向影響


Enable to redefine the specification of Process Machine & Material

APT’s solution not just benefit product quality but also cost through redefining the specification of process machine & material which impacts supplier and offers various selections to user.
封裝

先進封裝必定遇到的課題


Process Issues

Materials in Advanced Packages

Advanced Package


Material Issue Process
DAF/DAP Voids DB, Die Attach
Lamination
Encapsulation
TIM Voids Metal Soldering
Paste Sintering
NCF Cold Joint
Voids
HBM stacking
Under-fill Voids CUF
EMC Warpage EMIB,
CoWoS, InFO
Polyimide Voids
UPH
Adhesion
RDL

APT Solutions

扇出晶圓級封裝與製程

扇出晶圓級封裝製程除泡烘烤的最佳解決方案


offers Devoid & Cure solution

offers Devoid & Cure solution

材料

封裝製程黏合材料,提供最佳製程除泡方案覆蓋


量身訂做計畫

想進一步了解製程解決方案或提出問題嗎?

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