Ableprint Technology at the 2021 ECTC 【Published technical paper】

The ECTC (The Electronic Components and Technology Conference), The World’s Premier event of advanced IC packaging technology, hosted by the IEEE Electronics packaging society announced that due to the impact of Covid-19 pandemic, online registrations will be adopted this year. From June 1^st till July 4^th 2021, applicants can register at http://ectc.net/registration/index.cfm and listen to hundreds of technical experts from various countries share the latest IC packaging technology online

Ableprint Technology and its partner Winstek Semiconductor Technology Co., Ltd announced their lasted technology regarding packaging process. Discussing the impact of high-pressure baking for eliminating voids in the PI process and the reduction in the reaction time. 

AblePrint Technology published Technical paper:
Session 43: Manufacturing Techniques for Emerging Packaging Requirements
10th Topic:  Effect of Pneumatic Curing on Cycle Time Reduction and Void Suppression of Polyimide Wafer Coating

• Huan-Ping Su - Ableprint Technology Co. Ltd.


• Cheng-Che Tsou - Winstek Semiconductor Technology Co. Ltd.


• Auger Horng - Ableprint Technology Co. Ltd.

For more information, please follow ECTC2021 website: http://ectc.net/program/index.cfm