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Ableprint Technology at the 2023 EPTC 【Technical Papers】

2023/12/27

Ableprint Technology and its partner SHENMAO Technology Inc. announced their lasted technology regarding packaging process.

Technical Papers：
A Novel Approach to Enhance the High-Reliability of Solder Joints through Pneumatic Reflow Technology for Kirkendall Void Reduction

  • Huan-Ping Su - Ableprint Technology Co. Ltd.

  • Ming Hua Hsu - Ableprint Technology Co. Ltd.

  • Chih-Hsiung Chen - Ableprint Technology Co. Ltd.

  • Auger Horng - Ableprint Technology Co. Ltd.

    • Link 

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