About APT
AblePrint technology's History
AblePrint technology was established in 2007(TWSE: 7734). Since the beginning, APT understood the industrial competitiveness, it proposed four major unforeseen process issues that advanced packaging might face to enter the market, and those issues are process voids, warpage, heat dissipation, and high-temperature reflow soldering. To become a partner that customers can rely on, AblePrint technology provides a complete system to solve the advanced packaging issues and reduces manufacturing costs.
Based on the understanding of equipment and materials, self-developed design, experience, and intellectual property rights to face various problems in high-end packaging. APT remains focused and continued to solve those packaging process issues.
Based on the understanding of equipment and materials, self-developed design, experience, and intellectual property rights to face various problems in high-end packaging. APT remains focused and continued to solve those packaging process issues.
Core competitiveness
AblePrint’s core technology is “The Pneumatic & Thermal Modulation of high-pressure and low-pressure gas at high temperature and low temperature”, and it is recognized by the industry as a "process de-void solution expert". With this technology, we expanded from providing solutions to eliminate process voids to providing solutions to process problems such as “package warpage suppression”, “void-free soldering” and “high-power and high-efficiency package chip heat dissipation”, using these solutions for horizontal integration development -"Automated Production Handling System" and "Process Performance Integration System" two business units with unique characteristics.
AblePrint technology recognizes the customer’s production habits, this is why the unique products and developed technologies are unregarded as the only core competence. Practically, the core competence is we emphasize “helping customers by significantly reducing manufacturing costs.” APT uses few methods to enhance costs for customers, the methods are redefining the equipment and material specifications; simplifying the processes; increasing production capacity; saving materials; improving yield and quality; shorting the processing time; and leading-in rapid mass production.
AblePrint technology recognizes the customer’s production habits, this is why the unique products and developed technologies are unregarded as the only core competence. Practically, the core competence is we emphasize “helping customers by significantly reducing manufacturing costs.” APT uses few methods to enhance costs for customers, the methods are redefining the equipment and material specifications; simplifying the processes; increasing production capacity; saving materials; improving yield and quality; shorting the processing time; and leading-in rapid mass production.
Business concept
AblePrint technology stands by the concept of “Focusing on its own business, continuing to innovate, and putting quality as a priority”, since its foundation. APT is self-branded, it is being the frontier of technology, and has been positioned as a "process solution provider" instead of just providing me-too-equipment. The market share of the void process solution system provided in the semiconductor packaging market has reached nearly 80% globally. Every product provides at least one process solution, and allow customers to become more competitive in manufacturing processes.
Expertise
Continue to improve the understanding of packaging, testing process, and solving the current and future issues. While providing customers with process solutions, and proposing significant cost reduction solutions.Innovation
APT does not develop mass-produced productions on the market, because its mission is to assist in solving process issues. Thepurpose of having products developed is to meet the customer's needs.Quality
The key to quality is management. The ISO 9001 quality management principles are implemented in the daily routine of each department. In addition to continuously improving to achieve quality commitment towards customers
Quality policy
In AblePrint technology, every department shall establish quality objectives and implementation plans, and reviews their applicability. The supervisor of each department needs to ensure that all colleagues working in the company have a sufficient understanding of the quality policy and management system and apply them to their daily working hours. Everyone needs to establish and maintain an efficient, economical, and adhere to the requirements of the international quality management system to achieve our goals.
To achieve the quality policy, implement the following:
APT is determined to implement and continue implementing the ISO 9001 quality assurance system.
APT is determined to maintain and committed to achieving the quality policy.
To achieve the quality policy, implement the following:
APT is determined to implement and continue implementing the ISO 9001 quality assurance system.
APT is determined to maintain and committed to achieving the quality policy.
Company history
2007
Established the company with a registered capital of NTD 3 million.Introduced the first-generation VFS: Void Free System for leading-edge packaging.
2008
Obtained a new patent for "Bubble Removal Oven Device for Semiconductor Packaging Processes."2009
Received an invention patent for "Bubble Removal Method for Adhesive Layers in Semiconductor Packaging."Conducted a cash increase of NTD 5 million, raising the paid-in capital to NTD 8 million.
2012
Acquired a new patent for "Gas Concentration Control Device for Pressure Vessels."2013
Company renamed to "Ableprint Technology Co., Ltd."Conducted a cash increase of NTD 22 million, raising the paid-in capital to NTD 30 million.
Obtained a new patent for "Heat Carrier Device with Extended Communication Channel Structure for Semiconductor Packaging."
2014
Moved into the Zhunan Base of the Hsinchu Science Park.Introduced the second-generation VTS: Void Terminator System for wafer-level packaging automated bubble removal systems.
Obtained invention patents for various technologies including gas pressure to suppress substrate warping, chip bonding devices, and more.
2016
Obtained an invention patent for "Method to Suppress Material Warping Using Differential Pressure."Achieved ISO9001 Quality Management System certification.
Launched a bubble removal system for Fan-Out Panel Level Packaging applications.
2017
Conducted a cash increase of NTD 30 million, raising the paid-in capital to NTD 60 million.Obtained invention patents for various technologies including chip encapsulation processes, manufacturing methods and equipment for electronic components, and gas density adjustment methods.
Introduced the first automated magazine handling bubble removal system.
2018
Obtained an invention patent for "Method of Treating Electronic Encapsulation Structures."2019
Conducted a cash increase of NTD 45.35 million, raising the paid-in capital to NTD 105.35 million.Obtained invention patents for "Heating and Pressurizing Furnace for Manufacturing Electronic Components."
Received the 19th Golden Peak Awards for Top 10 Outstanding Enterprises and Top 10 Outstanding Innovations.
Introduced the third-generation PIoneer & PRO cross-border grid new models for high-temperature vacuum pressure environments in bump processing and reflow processes.
2020
Received the 29th National Strong Rock Award, 27th SME Innovation Research Award, and 23rd SME Giant Award.Launched the best automated material handling solution for packaging plants.
2021
Obtained invention patents for "Temperature Adjustment Device for High-Temperature Ovens" and "High-Pressure Burst Test Equipment."Achieved ISO27001 Information Security Management System certification.
2022
Increased capital by NTD 50 million through surplus conversion, raising the paid-in capital to NTD 155.35 million.Introduced the 3.5th generation LEAPSolve Platform for high-performance packaging technology solutions.
Invested in ABLEPRINT TECHNOLOGY HONGKONG LIMITED in Hong Kong for control operations.
Established a subsidiary in Shanghai (CAPT Semiconductor (Shanghai) Co., Ltd.), engaged in the production and sale of pneumatic and thermal process equipment.
Obtained invention patents for various technologies including reflow soldering furnace with anti-warping, contact-type overhead conveyor (OHT) dust collection system, and rapid sorting device for heating and pressurizing furnace for electronic component.
2023
Conducted a cash increase of NTD 31.5 million and issued employee stock warrants worth NTD 8 million, raising the paid-in capital to NTD 194.85 million.Introduced the 4th generation LEAPSolve Platform to drive advanced packaging technology solutions.
Headquarters relocated to Xiangshan, Hsinchu.
Established Zhunan Branch.
Obtained invention patents for "Mobile Trolley Automated Handling Track" and "Gas Recovery Equipment."
Effective public offering of stocks in December.
Received the 77th Golden Merchant Award.
2024
Conducted a cash increase of NTD 6 million, raising the paid-in capital to NTD 200.85 million.Received the 7th Potential Mid-Sized Enterprise Award.