印能科技於 2023 EPTC 【技術論文發表】
2023/12/27
印能科技與合作夥伴昇貿科技股份有限公司,於2023年 IEEE 25 th Electronics Packaging Technology Conference (EPTC) 發表最新封裝製程技術。
技術論文發表:
A Novel Approach to Enhance the High-Reliability of Solder Joints through Pneumatic Reflow Technology for Kirkendall Void Reduction
技術論文連結
技術論文發表:
A Novel Approach to Enhance the High-Reliability of Solder Joints through Pneumatic Reflow Technology for Kirkendall Void Reduction
- Huan-Ping Su - Ableprint Technology Co. Ltd.
- Ming Hua Hsu - Ableprint Technology Co. Ltd.
- Chih-Hsiung Chen - Ableprint Technology Co. Ltd.
- Auger Horng - Ableprint Technology Co. Ltd.
技術論文連結