製程解決方案與產品應用
Process Solution Provider
全球超過1,800套製程除泡解決方案，應用於各類製程、封裝與材料
製程
印能解決方案平台對製程帶來的正向影響
Enable to redefine the specification of Process Machine & Material
APT’s solution not just benefit product quality but also cost through redefining the specification of process machine & material which impacts supplier and offers various selections to user.
封裝
先進封裝必定遇到的課題
Process Issues
Materials in Advanced Packages
Advanced Package
| Material | Issue | Process |
| DAF/DAP | Voids | DB, Die Attach |
| Lamination | ||
| Encapsulation | ||
| TIM | Voids | Metal Soldering |
| Paste Sintering | ||
| NCF | Cold Joint Voids |
HBM stacking |
| Under-fill | Voids | CUF |
| EMC | Warpage | EMIB, CoWoS, InFO |
| Polyimide | Voids UPH Adhesion |
RDL |
APT Solutions
扇出晶圓級封裝與製程
扇出晶圓級封裝製程除泡烘烤的最佳解決方案
offers Devoid & Cure solution
offers Devoid & Cure solution
材料
封裝製程黏合材料，提供最佳製程除泡方案覆蓋
量身訂做計畫
