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Ableprint Technology at the 2021 EPTC 【Technical Papers】

2021/12/1

Ableprint Technology and its partner SHENMAO Technology Inc. announced their lasted technology regarding packaging process.

Technical Papers: Effect of Pneumatic Reflow Profiling on Voiding Reduction in High-Lead Solder Die Attach

Huan-Ping Su - Ableprint Technology Co. Ltd.

Shih-Hao Lee - Ableprint Technology Co. Ltd.

Kai-Jun Hung - Ableprint Technology Co. Ltd.

Chun-Cheng Lee - SHENMAO Technology Inc.

Auger Horng - Ableprint Technology Co. Ltd.

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